Full Description

This standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a baseline profile, and then provides requirements to verify repeatability through periodic verification of the oven profile.

This standard is not intended for the assembly product profile/recipe. For detailed information on development or verification of a product profile/recipe, see IPC-7530.

This standard does not address vapor phase processes. Batch ovens offer lower throughput and are also not covered in this standard.