No products
New product
This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.
Author | EIA |
---|---|
Editor | EIA |
Document type | Standard |
Format | File |
ICS | 33.040.50 : Lines, connections and circuits
|
Number of pages | 10 |
Year | 1980 |
Document history | |
Country | USA |
Keyword | EIA 11;11;EIA JESD11 |