Cart
0
Product
Products
(empty)
No products
To be determined
Shipping
$0.00
Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart.
There is 1 item in your cart.
Total products
Total shipping
To be determined
Total
Reduced price!
View larger
View larger
EIA-540FAAD:1992
New product
EIA-540FAAD:1992
Detail Specification for Multi- Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic EquipmentMore info
The Multi-Package Module Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working voltage not to exceed 250 volts (rms). c) Current not to exceed 1.0 amperes per pin. OBJECT The object of this Detail Specification is to provide all information required using Sectional Specification EIA-540F000 as a base, for the identification and quality assessment of Multi- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.220.10 : Plug-and-socket devices. Connectors
|
| Number of pages | 24 |
| Cross references | ANSI/EIA-540FAAD (1992), IDT |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA 540FA;540FA |