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EIA JESD 51-11:2001

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EIA JESD 51-11:2001

Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements

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This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 17.200.01 : Thermodynamics in general
Number of pages 18
Year 2001
Document history
Country USA
Keyword EIA JESD 51;EIA 51;EIA 51.11;51;EIA JESD51-11