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This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests.
Author | EIA |
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Editor | EIA |
Document type | Standard |
Format | File |
Confirmation date | 2009-09-01 |
ICS | 31.200 : Integrated circuits. Microelectronics
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Number of pages | 32 |
Year | 2002 |
Document history | |
Country | USA |
Keyword | EIA 142;142;EIA JEP142 |