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EIA JEP 140:2002 (R2015)
New product
EIA JEP 140:2002 (R2015)
Beaded Thermocouple Temperature Measurement of Semiconductor PackagesMore info
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| Confirmation date | 2015-01-01 |
| ICS | 17.200.20 : Temperature-measuring instruments
|
| Number of pages | 14 |
| Year | 2002 |
| Document history | |
| Country | USA |
| Keyword | EIA 140;140;EIA JEP140 |