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EIA JEP 158:2009

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EIA JEP 158:2009

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions

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The intent of this publication is to document and provide critical information to assess and make decisions on safe CDM ESD level requirements. The scope of this document is to provide this information to quality organizations in both semiconductor companies and their IC customers. Special Notes on System Level ESD: 1. This work and the recommendations therein are intended for Component Level safe ESD requirements and will have little or no effect on system level ESD results. 2. Systems and System boards should continue to be designed to meet appropriate ESD threats regardless of the components in the systems that are meeting the new recommendations from this work, and that all proper system reliability must be assessed through the IEC test method.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 31.200 : Integrated circuits. Microelectronics
Number of pages 24
Year 2009
Document history
Country USA
Keyword EIA 158;158;EIA JEP158