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EIA JESD 51-32:2010
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EIA JESD 51-32:2010
EXTENSION TO JESD51 THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGESMore info
This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described below also are applicable to single chip packages needing more than 36 electrical connections for the test.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.080.01 : Semiconductor devices in general
|
| Number of pages | 10 |
| Year | 2010 |
| Document history | |
| Country | USA |
| Keyword | EIA JESD 51;EIA 51;EIA 51.32;51;EIA JESD51-32 |