EIA JEP 144A:2011

This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. A compendium of references to reports, papers, and texts, relating to internal gas analysis, volatile gasses, and sealed packages is included in Annex D. This guideline describes how to select a lab, the internal gas analysis testing process, and the interpretation of the test results. Lists of common failure mechanisms can be found in Annex A. A brief discussion of process characterization and process control is included. Annex C contains supplemental methods for measuring moisture content along with their advantages and disadvantages.