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EIA JEP 167:2013

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EIA JEP 167:2013

Characterization of Interfacial Adhesion in Semiconductor Packages

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This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle. NOTE Inclusion in this directory of methods does not imply applicability to all die-package configurations.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 31.080.01 : Semiconductor devices in general
Number of pages 30
Year 2013
Document history
Country USA
Keyword EIA 167;167;EIA JEP167