EIA JEP 001-3A:2018

This document describes package-level test and data methods for the qualification of semiconductor technologies. It does not give pass or fail values or recommend specific test equipment, test structures or test algorithms. Wherever possible, it references applicable JEDEC such as JESD47 or other widely accepted standards for requirements documentation. There are two levels of qualification described. Level 1 is a pure process qualification intended to find reliability weaknesses. It primarily addresses technology wearout mechanisms through package or wafer level reliability tests on specially designed test structures. Level 2 demonstrates the reliability of the process that corresponds to the reliability demands from projected or known applications. Level 2 testing can be implemented via the testing of a relevant functional technology qualification vehicle (TQV), including life test. The level 2 tests are described in clause 12. Other Reporting requirements (e.g., PCM data) are also included.