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The purpose of these tests is to evaluate materials and/or connector/socket assemblies as they are impacted by the effects of high humidity and heat. These tests are intended to be non-condensing.
Author | EIA |
---|---|
Editor | EIA |
Document type | Standard |
Format | File |
ICS | 29.120.20 : Connecting devices
|
Number of pages | 21 |
Replace | EIA-364-31E (2017-04) |
Year | 2019 |
Country | USA |
Keyword | EIA 364;EIA 364.32G;EIA-364;364 |