EIA JESD 22-B109B:2014

This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength. It should be used to assess the consistency and quality of the chip join process and solder joint integrity across a given flip chip die. This method covers both Pb and Pb-free solder bumps. NOTE Considering that this is a destructive test, it may be not suitable for qualification or process development where medium to high volume sampling might be necessary. In manufacturing, this test can be used to compare to original baseline results.