No products
New product
The Steady-State Temperature-Humidity Bias Life Test is performed to evaluate the reliability of nonhermetic packaged IC devices in humid environments. Temperature, humidity, and bias conditions are applied to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it.
Author | EIA |
---|---|
Editor | EIA |
Document type | Standard |
Format | File |
ICS | 17.200.01 : Thermodynamics in general
|
Number of pages | 12 |
Replace | EIA JESD 22-A101C (2009-03) |
Year | 2015 |
Document history | EIA JESD 22-A101D (2015-07) |
Country | USA |
Keyword | EIA JESD 22;EIA 22;EIA 22.A101D;22;EIA JESD22-A101D |