Full Description

This specification details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.

Product Details

Published: 01/01/2008 Number of Pages: 14File Size: 1 file , 110 KB