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JEDEC JESD22-A113F PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING standard by JEDEC Solid State Technology Association, 10/01/2008
JEDEC JESD201A ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JEP 155 RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD30E DESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGES standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD51-31 THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD15-3 TWO-RESISTOR COMPACT THERMAL MODEL GUIDELINE standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD 22-A121A (R2014) MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD 82-28A FULLY BUFFERED DIMM DESIGN FOR TEST, DESIGN FOR VALIDATION (DFx) standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JEP 143B.01 SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES standard by JEDEC Solid State Technology Association, 06/01/2008
JEDEC JESD94A APPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY standard by JEDEC Solid State Technology Association, 07/01/2008
JEDEC JESD204A SERIAL INTERFACE FOR DATA CONVERTERS standard by JEDEC Solid State Technology Association, 04/01/2008
JEDEC JESD22-B106D RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES standard by JEDEC Solid State Technology Association, 04/01/2008